✦ LIBER ✦
Fluxless flip–chip SnAu solder interconnect on thin Si wafers and Cu laminated polyimide films
✍ Scribed by Dongwook Kim; Chin C. Lee
- Book ID
- 103840929
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 598 KB
- Volume
- 416
- Category
- Article
- ISSN
- 0921-5093
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