Fluorene-Containing Poly(ester imide)s and their Application to Positive-Type Photosensitive Heat-Resistant Materials
✍ Scribed by Masatoshi Hasegawa; Azumi Tominaga
- Publisher
- John Wiley and Sons
- Year
- 2011
- Tongue
- English
- Weight
- 612 KB
- Volume
- 296
- Category
- Article
- ISSN
- 1438-7492
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✦ Synopsis
Abstract
Poly(ester imide)s (PEsIs) were prepared from fluorene (FL)‐containing ester‐linked tetracarboxylic dianhydrides and various diamines. The PEsI films achieved excellent combined properties: very high T~g~'s exceeding 300 °C in some cases, relatively low water absorption, good thermoplasticity, and excellent solubility in common aprotic organic solvents [even when rigid diamines such as p‐phenylenediamine and trans‐1,4‐cyclohexanediamine (CHDA) were used]. In particular, the PEsI film obtained from CHDA also displayed good optical transparency owing to inhibited charge‐transfer interactions. The partial incorporation of the FL‐containing unit into a colorless polyimide system with an extremely low dielectric constant enabled us to form a fine positive‐tone pattern by a photolithograghic technique.
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