Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels

✍ Scribed by Chen, H.D.; Liang, K.; Zeng, Q.M.; Li, X.J.; Chen, Z.B.; Du, Y.; Wu, R.H.

• Book ID: 114455823
• Publisher: The Institution of Electrical Engineers
• Year: 2000
• Tongue: English
• Weight: 545 KB
• Volume: 147
• Category: Article
• ISSN: 1350-2433
• DOI: 10.1049/ip-opt:20000380