✦ LIBER ✦
Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors
✍ Scribed by Faheem, F.F.; Gupta, K.C.; Yung-Cheng Lee
- Book ID
- 114659897
- Publisher
- IEEE
- Year
- 2003
- Tongue
- English
- Weight
- 805 KB
- Volume
- 51
- Category
- Article
- ISSN
- 0018-9480
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