First-principle study on substitution of Cu or P into Ni–Sn intermetallic compounds

✍ Scribed by T.J. Chung; W.H. Moon; Y.G. Park; M.C. Kim; C.K. Choi

• Book ID: 116574837
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 715 KB
• Volume: 18
• Category: Article
• ISSN: 0966-9795
• DOI: 10.1016/j.intermet.2010.03.022