Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters

✍ Scribed by K.-S. Chen; H.-M. Yeh; J.-L. Yan; Y.-T. Chen

• Book ID: 105852878
• Publisher: Springer
• Year: 2008
• Tongue: English
• Weight: 601 KB
• Volume: 42
• Category: Article
• ISSN: 0268-3768
• DOI: 10.1007/s00170-008-1672-5