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Finite-element analysis of thermal stresses in a silicon pressure sensor for various die-mount materials

✍ Scribed by Yu-Cheng Lin; Peter J. Hesketh; John P. Schuster

Publisher: Elsevier Science
Year: 1994
Tongue: English
Weight: 458 KB
Volume: 44
Category: Article
ISSN: 0924-4247
DOI: 10.1016/0924-4247(94)00811-6

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