Fine grinding of silicon wafers: machine configurations for spindle angle adjustments

✍ Scribed by Wangping Sun; Z.J. Pei; Graham R. Fisher

• Book ID: 108145825
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 459 KB
• Volume: 45
• Category: Article
• ISSN: 0890-6955
• DOI: 10.1016/j.ijmachtools.2004.06.013