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Filling and solidification of TiAl melt in centrifugal field

✍ Scribed by Wen-bin SHENG

Book ID
117693175
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
468 KB
Volume
16
Category
Article
ISSN
1003-6326

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✍ C Beckermann; H.-J Diepers; I Steinbach; A Karma; X Tong πŸ“‚ Article πŸ“… 1999 πŸ› Elsevier Science 🌐 English βš– 385 KB

A novel diffuse interface model is presented for the direct numerical simulation of microstructure evolution in solidification processes involving convection in the liquid phase. The solidification front is treated as a moving interface in the diffuse approximation as known from phase-field theories