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Fatigue strength of tungsten-copper duplex structures for divertor plates

✍ Scribed by M. Seki; T. Horie; T. Tone; K. Nagata; K. Kitamura; Y. Shibutani; M. Shibui; T. Araki


Book ID
107810190
Publisher
Elsevier Science
Year
1988
Tongue
English
Weight
667 KB
Volume
155-157
Category
Article
ISSN
0022-3115

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Residual stresses that developed during cooling of the tungsten-copper duplex structure were measured by the strain gauge method and compared with those by thermoelastic-plastic analyses. Good agreement was obtained for both residual stress and displacement, even when the creep effect of the copper