✦ LIBER ✦
Fatigue crack growth behavior in Sn–Pb eutectic solder/copper joint under mode I loading
✍ Scribed by C. Kanchanomai; W. Limtrakarn; Y. Mutoh
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 504 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0167-6636
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