𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Fast multi-frequency extraction of 3D impedance based on boundary element method

✍ Scribed by Wenjian Yu; Changhao Yan; Zeyi Wang

Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
871 KB
Volume
50
Category
Article
ISSN
0895-2477

No coin nor oath required. For personal study only.

✦ Synopsis

Abstract

For the boundary element method used in an impedance extractor FastImp, a scheme to handle the boundary integrals is proposed to accelerate the computation for multiple frequencies. Several techniques are combined in the scheme. The near‐field integrals are calculated with a series expansion technique and an approximate formula, whereas the precorrected FFT algorithm is employed for the far‐field integrals. Numerical experiments show that the proposed method is several times faster than FastImp for multi‐frequency extraction, while preserving high accuracy. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 2191–2197, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23597

📜 SIMILAR VOLUMES

A Parallel Implementation of a Fast Mult
A Parallel Implementation of a Fast Multipole-Based 3-D Capacitance Extraction Program on Distributed Memory Multicomputers
✍ Yanhong Yuan; Prith Banerjee 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 396 KB

Very fast and accurate 3-D capacitance extraction is essential for interconnect optimization in VLSI ultra-deep sub-micron designs (UDSM). Parallel processing provides an approach to reducing the simulation turn-around time. This paper examines the parallelization of the well-known fast multipole-ba

A dual BIE approach for large-scale mode
A dual BIE approach for large-scale modelling of 3-D electrostatic problems with the fast multipole boundary element method
✍ Y. J. Liu; L. Shen 📂 Article 📅 2007 🏛 John Wiley and Sons 🌐 English ⚖ 564 KB

## Abstract A dual boundary integral equation (BIE) formulation is presented for the analysis of general 3‐D electrostatic problems, especially those involving thin structures. This dual BIE formulation uses a linear combination of the conventional BIE and hypersingular BIE on the entire boundary o

The computation of the input impedance o
The computation of the input impedance of a biconical antenna by means of a method of segmentation based on 3D finite elements
✍ José Ma Gil; Jesús Rubio; Juan Zapata 📂 Article 📅 2003 🏛 John Wiley and Sons 🌐 English ⚖ 173 KB

## Abstract The analysis of structures with complex geometries leads to the use of three‐dimensional numerical methods. Such devices can be unmanageable unless a segmentation technique is applied. In this work, a hybrid 3D finite‐element‐mode matching method, based on the generalized admittance mat

Numerical calculation of grounding syste
Numerical calculation of grounding system buried in vertical earth model in low frequency domain based on the boundary element method
✍ Zhong-Xin Li; Guang-Fan Li; Jian-Bin Fan; Cui-Xia Zhang 📂 Article 📅 2009 🏛 John Wiley and Sons 🌐 English ⚖ 665 KB

## Abstract To solve a grounding problem which describes a grounding system with floating metallic conductors buried in vertical multilayer earth model under a high voltage a.c. substation, a new mathematical model for accurately computing currents flowing along conductors of the grounding system h

3D quantum transport solver based on the
3D quantum transport solver based on the perfectly matched layer and spectral element methods for the simulation of semiconductor nanodevices
✍ Candong Cheng; Joon-Ho Lee; Kim Hwa Lim; Hisham Z. Massoud; Qing Huo Liu 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 437 KB

A 3-D quantum transport solver based on the spectral element method (SEM) and perfectly matched layer (PML) is introduced to solve the 3-D Schrödinger equation with a tensor effective mass. In this solver, the influence of the environment is replaced with the artificial PML open boundary extended be