✦ LIBER ✦
Failure paths at copper-base leadframe/epoxy molding compound interfaces
✍ Scribed by H. Y. Lee; G. S. Park
- Book ID
- 110392383
- Publisher
- Springer
- Year
- 2002
- Tongue
- English
- Weight
- 788 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0022-2461
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