✦ LIBER ✦
Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies
✍ Scribed by J.W. Jang; J.K. Lin; D.R. Frear
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 391 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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