Failure mechanisms in peeling of pressure-sensitive adhesive tape
β Scribed by D. W. Aubrey; G. N. Welding; T. Wong
- Publisher
- John Wiley and Sons
- Year
- 1969
- Tongue
- English
- Weight
- 772 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Fracture is a very complicated phenomenon and its dynamics is not well described up to now by a consistent physical and/or mathematical model. In this paper we synthetically present the main experimental and theoretical results for the peeling of an adhesive tape, i.e. a viscoelastic dissipative sys
In this article we use a linear elastic fracture mechanics approach to characterize the adhesive performance of two commercially available pressure-sensitive adhesives (PSAs). An axisymmetric adhesion test involving the contact of a spherical indenter with a thin adhesive layer is used to generate "