✦ LIBER ✦
Failure behavior of ITO diffusion barrier between electroplating Cu and Si substrate annealed in a low vacuum
✍ Scribed by S.H. Hsieh; C.M. Chien; W.L. Liu; W.J. Chen
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 437 KB
- Volume
- 255
- Category
- Article
- ISSN
- 0169-4332
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