Failure Analysis of Integrated Circuits: Tools and Techniques

✍ Scribed by Lawrence C. Wagner (auth.), Lawrence C. Wagner Ph.D. (eds.)

• Publisher: Springer US
• Year: 1999
• Tongue: English
• Leaves: 255
• Series: The Springer International Series in Engineering and Computer Science 494
• Edition: 1
• Category: Library

✦ Synopsis

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

✦ Table of Contents

Front Matter....Pages i-xiii
Introduction....Pages 1-11
Electrical Characterization....Pages 13-41
Package Analysis: SAM and X-ray....Pages 43-57
Die Exposure....Pages 59-66
Global Failure Site Isolation: Thermal Techniques....Pages 67-86
Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques....Pages 87-112
Probing Technology for IC Diagnosis....Pages 113-143
IC Deprocessing....Pages 145-157
Cross-Section Analysis....Pages 159-173
Inspection Techniques....Pages 175-193
Chemical Analysis....Pages 195-203
Energy Dispersive Spectroscopy....Pages 205-215
Auger Electron Spectroscopy....Pages 217-227
Secondary Ion Mass Spectrometry, SIMS....Pages 229-240
FA Future Requirements....Pages 241-250
Back Matter....Pages 251-255

✦ Subjects

Optical and Electronic Materials; Electrical Engineering