Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding

✍ Scribed by Y.J. Chen; C.C. Chang; H.Y. Lin; S.C. Hsu; C.Y. Liu

• Book ID: 113800459
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 663 KB
• Volume: 52
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2010.11.010