✦ LIBER ✦
Fabrication of through substrate grooves on GaAs by deep wet etching and its application in GaAs CCD wafer level packaging
✍ Scribed by Wang, S. F.; Han, M.; Ye, J. T.; Xu, G. W.; Luo, L.
- Book ID
- 125349098
- Publisher
- Springer-Verlag
- Year
- 2013
- Tongue
- English
- Weight
- 631 KB
- Volume
- 21
- Category
- Article
- ISSN
- 0946-7076
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