✦ LIBER ✦
Fabrication of SOI structures with buried cavities using Si wafer direct bonding and electrochemical etch-stop
✍ Scribed by Gwiy-Sang Chung
- Publisher
- TechnoPress
- Year
- 2003
- Tongue
- English
- Weight
- 457 KB
- Volume
- 9
- Category
- Article
- ISSN
- 1598-9623
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