This paper presents a process technology for cost-effective integration of low-power flash memories into a 0.25 mm, high performance SiGe:C RF-BiCMOS process. Only four additional lithographic steps are used on top of the baseline BiCMOS process, leading to in total 23 mask levels for the BiCMOS/emb
Fabrication of MEMS actuators from the BEOL of a 0.25μm BiCMOS technology platform
✍ Scribed by Kulse, P.; Birkholz, M.; Ehwald, K.-E.; Bauer, J.; Drews, J.; Haak, U.; Höppner, W.; Katzer, J.; Schulz, K.; Wolansky, D.
- Book ID
- 122000425
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 567 KB
- Volume
- 97
- Category
- Article
- ISSN
- 0167-9317
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