✦ LIBER ✦

Fabrication and thermal analysis of a copper/diamond/copper thermal spreading device

✍ Scribed by Tai-Fa Young

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fabrication and thermal conductivity of

✍ Ying-Hu Dong; Xin-Bo He; Rafi-ud-din; Liang Xu; Xuan-Hui Qu 📂 Article 📅 2011 🏛 Springer 🌐 English ⚖ 350 KB

Fabrication and Thermal Conductivity of

✍ MARUYAMA, Tadashi; ONOSE, Shoji 📂 Article 📅 1999 🏛 Japan Science and Technology Information Aggregato 🌐 English ⚖ 710 KB

Thermal stress and heat transfer charact

✍ Chen, Yi-Jiun; Young, Tai-Fa 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 600 KB

Filler-matrix thermal boundary resistanc

✍ A. M. Abyzov; S. V. Kidalov; F. M. Shakhov 📂 Article 📅 2012 🏛 SP MAIK Nauka/Interperiodica 🌐 English ⚖ 206 KB

Microstructure and thermal properties of

✍ Kang, Qiping; He, Xinbo; Ren, Shubin; Liu, Tingting; Liu, Qian; Wu, Mao; Qu, Xua 📂 Article 📅 2015 🏛 Elsevier Science 🌐 English ⚖ 580 KB

Thermal analysis applied to characteriza

✍ J. A. Moura; A. S. Araujo; A.C. S. L. S. Coutinho; Joana M. F. B. Aquino; A. O. 📂 Article 📅 2005 🏛 Springer Netherlands 🌐 English ⚖ 351 KB