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Fabrication and formation of Ta/Pt-Si ohmic contacts applied to high-temperature Through Silicon Vias (TSVs)

✍ Scribed by Gueye, R.; Akiyama, T.; Briand, D.; de Rooij, N.F.


Book ID
120087873
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
745 KB
Volume
191
Category
Article
ISSN
0924-4247

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