Fabrication and characterization of micro-sized copper bump of multi-layer PCB by pulse-reverse electroplating

✍ Scribed by Hyun Seon Hong; Min Hye Seo; Sungkyu Lee; Soon Jik Hong; H.G. Suk; Jae-Hwan Ahn

• Book ID: 108079425
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 629 KB
• Volume: 11
• Category: Article
• ISSN: 1567-1739
• DOI: 10.1016/j.cap.2010.11.107