Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

✍ Scribed by Bo-In Noh; Jeong-Won Yoon; Seung-Boo Jung

• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 523 KB
• Volume: 88
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2011.01.071