Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions

✍ Scribed by S. Carubelli; Z. Khatir

• Book ID: 108360916
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 671 KB
• Volume: 34
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(03)00205-2