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Experimental study on the application of paraffin slurry to high density electronic package cooling

✍ Scribed by K. Cho; M. Choi

Publisher: Springer-Verlag
Year: 2000
Tongue: English
Weight: 253 KB
Volume: 36
Category: Article
ISSN: 1432-1181
DOI: 10.1007/s002310050360

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