Experimental and analytical studies on r
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K. Kitamura; K. Nagata; M. Shibui; T. Fuse; N. Tachikawa; M. Akiba; M. Araki; M.
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Article
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1991
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Elsevier Science
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English
⚖ 471 KB
Residual stresses that developed during cooling of the tungsten-copper duplex structure were measured by the strain gauge method and compared with those by thermoelastic-plastic analyses. Good agreement was obtained for both residual stress and displacement, even when the creep effect of the copper