✦ LIBER ✦
Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards : J. Lau et al. Circuit World, 19(3), 18 (1993)
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 105 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0026-2714
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