Evolution of microstructure and electrical resistivity of Cu–12wt.%Ag filamentary microcomposite with drawing deformation

✍ Scribed by L. Zhang; L. Meng

• Book ID: 113895472
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 276 KB
• Volume: 52
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2005.03.016