✦ LIBER ✦
Evolution of deformation near the triple point of grain junctions in Sn-based solders during in situ tensile test
✍ Scribed by Ying Ding; Chunqing Wang; Mingyu Li; Han-Sur Bang
- Book ID
- 113788447
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 313 KB
- Volume
- 59
- Category
- Article
- ISSN
- 0167-577X
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