✦ LIBER ✦
Evaluation of Ta and TaN-based Cu diffusion barriers deposited by Advanced Hi-Fill (AHF) sputtering onto blanket wafers and high aspect ratio structures
✍ Scribed by S.R Burgess; H Donohue; K Buchanan; N Rimmer; P Rich
- Book ID
- 108411240
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 453 KB
- Volume
- 64
- Category
- Article
- ISSN
- 0167-9317
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