✦ LIBER ✦
Evaluation of Strain Measurement in a Die-to-Interposer Chip UsingIn SituSynchrotron X-Ray Diffraction and Finite-Element Analysis
✍ Scribed by Hsu, Hsueh-Hsien; Chiu, Tz-Cheng; Chang, Tao-Chih; Huang, Shin-Yi; Lee, Hsin-Yi; Ku, Ching-Shun; Lin, Yang-Yi; Su, Chien-Hao; Chou, Li-Wei; Ouyang, Yao-Tsung; Huang, YI-Ting; Wu, Albert T.
- Book ID
- 121583116
- Publisher
- Springer US
- Year
- 2013
- Tongue
- English
- Weight
- 261 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0361-5235
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