✦ LIBER ✦
Evaluation of Residual Stress in Flip Chip Using 3-D Optical Interferometry/FEM Hybrid Technique
✍ Scribed by F. Su; L. Liu; T. Wang
- Book ID
- 111200793
- Publisher
- John Wiley and Sons
- Year
- 2007
- Tongue
- English
- Weight
- 181 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0039-2103
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