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Evaluation of processing options to avoid the passivation of chalcopyrite

✍ Scribed by Debernardi, Gianfranco; Gentina, Juan Carlos; Albistur, Pablo; Slanzi, Gino

Book ID
121403716
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
439 KB
Volume
125
Category
Article
ISSN
0301-7516

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Because of its large dimension and its high level of integration, the PICS (Passive Integration Connecting Substrate) developed by NXP prone to top to bottom metal short (TBMS) failure during temperature cycling test. Several options of process modifications as well as new design rules and stress re