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Evaluation of melamine-modified urea-formaldehyde resins as particleboard binders

✍ Scribed by B. Young No; Moon G. Kim

Publisher
John Wiley and Sons
Year
2007
Tongue
English
Weight
378 KB
Volume
106
Category
Article
ISSN
0021-8995

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Curing of low level melamine-modified ur
Curing of low level melamine-modified urea-formaldehyde particleboard binder resins studied with dynamic mechanical analysis (DMA)
✍ B. Young No; Moon G. Kim 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 170 KB 👁 2 views

## Abstract Effects of resin formulation, catalyst, and curing temperature were studied for particleboard binder‐type urea‐formaldehyde (UF) and 6 ∼ 12% melamine‐modified urea‐melamine‐formaldehyde (UMF) resins using the dynamic mechanical analysis method at 125 ∼ 160°C. In general, the UF and UMF