41979 Evaluation of bond testing equipme
โฆ LIBER โฆ
Evaluation of bond testing equipment
- Publisher
- Elsevier Science
- Year
- 1990
- Weight
- 202 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0308-9126
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Any time a structure experiences stress reversal, part of its life is used up. The two most common types of stress cycles that cause the most damage in electronic equipment are thermal/temperature cycling and vibration cycling. These two types of cycling can occur separately or they can be combined.