✦ LIBER ✦
Evaluation of adhesives for hybrid microcircuit package sealing : K. L. Perkins, J. J. Licari and S.V. Caruso. IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-1, (4) 412 (December 1978)
- Book ID
- 103277944
- Publisher
- Elsevier Science
- Year
- 1979
- Tongue
- English
- Weight
- 132 KB
- Volume
- 19
- Category
- Article
- ISSN
- 0026-2714
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