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Etchant Solutions for the Removal of Cu(0) in a Supercritical CO 2 -Based “Dry” Chemical Mechanical Planarization Process for Device Fabrication

✍ Scribed by Bessel, Carol A.; Denison, Ginger M.; DeSimone, Joseph M.; DeYoung, James; Gross, Stephen; Schauer, Cynthia K.; Visintin, Pamela M.


Book ID
126165671
Publisher
American Chemical Society
Year
2003
Tongue
English
Weight
96 KB
Volume
125
Category
Article
ISSN
0002-7863

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