✦ LIBER ✦
ESEEM of copper complexes formed in the interlayer between thiokol-epoxy adhesive and brass substrate
✍ Scribed by E. Nefed’ev; R. Gubaidullin; S. Orlinskii; R. Rakhmatullin
- Book ID
- 105723906
- Publisher
- Springer Vienna
- Year
- 2002
- Tongue
- English
- Weight
- 968 KB
- Volume
- 22
- Category
- Article
- ISSN
- 0937-9347
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