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Erratum: 3D Analysis of Heat Transfer Intensification by Re-Entrance Flow Pin-Fins Microstructures with a Highly Thermal-Conductive Plate

✍ Scribed by Q. Wang; V. Hessel; E. V. Rebrov; B. Werner


Publisher
John Wiley and Sons
Year
2011
Tongue
English
Weight
34 KB
Volume
34
Category
Article
ISSN
0930-7516

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