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Erosion resistance of polycrystalline diamond films to atomic oxygen

✍ Scribed by Jingqi Li; Qing Zhang; S.F. Yoon; J. Ahn; Qiang Zhou; Sigen Wang; Dajiang Yang; Qiang Wang

Book ID
104106612
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
122 KB
Volume
41
Category
Article
ISSN
0008-6223

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✦ Synopsis

Polycrystalline diamond films deposited using hot filament chemical vapor deposition (CVD) technique have been investigated in atomic oxygen simulated as low earth orbit environment to examine their erosion resistance properties. After 16 2 exposure to the atomic oxygen beam with a flux of 2.6310 atoms / cm s, the diamond films only show a small mass loss.

3

The reaction efficiency is estimated to be between 6.35310 and 8.28310 cm / atom. Oxidation mechanism is investigated through the reaction temperature influence on the reaction rate. We suggest that atomic oxygen reacts with diamond surface and forms ether (C-O-C) and carbonyl (.C=O) configurations besides eroding the surface.

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