Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

✍ Scribed by Hideaki Tsukamoto; Tetsuro Nishimura; Kazuhiro Nogita

• Book ID: 113793179
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 705 KB
• Volume: 63
• Category: Article
• ISSN: 0167-577X
• DOI: 10.1016/j.matlet.2009.09.041