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EOS nickel alloy suitable for high temperature processing

Book ID
122266309
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
426 KB
Volume
68
Category
Article
ISSN
0026-0657

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Study of SiCโ€“nickel alloy bonding for hi
Study of SiCโ€“nickel alloy bonding for high temperature applications
โœ M.L. Hattali; S. Valette; F. Ropital; G. Stremsdoerfer; N. Mesrati; D. Trรฉheux ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 947 KB

We have studied the formation of metal/ceramic joints by solid state bonding technique for applications at temperatures >600 โ€ข C. The bonding is obtained between silicon carbide (SiC) and Ni-based super-alloy (HAYNES ยฎ 214 TM ) via metallic foils (Ni, Ag). In some cases a thin coating on the ceramic