𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Enhancing wire-composite bond strength of bonded retainers with wire surface treatment

✍ Scribed by Larry J. Oesterle; W.Craig Shellhart; Stacy Henderson

Book ID
114488658
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
124 KB
Volume
119
Category
Article
ISSN
1097-6752

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Surface treatment of wire bonding metal
Surface treatment of wire bonding metal pads
✍ S. Alberici; D. Coulon; P. Joubin; Y. Mignot; L. Oggioni; P. Petruzza; D. Piumi; πŸ“‚ Article πŸ“… 2003 πŸ› Elsevier Science 🌐 English βš– 686 KB

The random formation of micrometric crystals on Al bonding pads can be an issue affecting wire bonding metal pad quality. The dry etch chemistry used to remove final passivation dielectric layers from the top of the bonding Al pad area is in fact based mainly on fluorine-containing gases (such as CF