Enhancement of the Bondability and Die-Shear Force of Chip–Flex Substrate Assemblies by Depositing a Nickel Layer on the Flex Substrate

✍ Scribed by Cheng-Li Chuang, Jong-Ning Aoh, Chi-Chuan Pan

• Book ID: 118816407
• Publisher: Springer US
• Year: 2012
• Tongue: English
• Weight: 954 KB
• Volume: 41
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-012-2172-9