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Enhanced Thermal Performance of InGaP/GaAs Collector-Up HBTs With a Miniaturized Backside Heat-Dissipation Structure

✍ Scribed by Tseng, Hsien-Cheng; Lin, Jer-Li

Book ID
118258314
Publisher
Institute of Electrical and Electronics Engineers
Year
2012
Tongue
English
Weight
522 KB
Volume
2
Category
Article
ISSN
2156-3950

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✍ Pei-Hsuan Lee; Hsien-Cheng Tseng; Jung-Hua Chou 📂 Article 📅 2009 🏛 John Wiley and Sons 🌐 English ⚖ 342 KB

## Abstract We build up a finite element modeling (FEM) approach to analyze the thermal performance of collector‐up (C‐up) heterojunction bipolar transistor (HBTs) with a heat‐dissipation via configuration. Highly compact heat‐dissipation packaging structures of GaInP/GaAs C‐up HBTs have been desig