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Enhanced convection from horizontal printed-circuit board with lifted electronic components

✍ Scribed by H. J. Kang; C. W. Leung

Book ID: 105925701
Publisher: Springer-Verlag
Year: 1998
Tongue: English
Weight: 420 KB
Volume: 33
Category: Article
ISSN: 1432-1181
DOI: 10.1007/s002310050188

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