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Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

✍ Scribed by Pavuluri, S.K.; Ferenets, M.; Goussetis, G.; Desmulliez, M.P.Y.; Tilford, T.; Adamietz, R.; Muller, G.; Eicher, F.; Bailey, C.

Book ID: 117913336
Publisher: Institute of Electrical and Electronics Engineers
Year: 2012
Tongue: English
Weight: 660 KB
Volume: 2
Category: Article
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2011.2177524

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