✦ LIBER ✦
Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance
✍ Scribed by Tomohiro Iwasaki; Jeong Hwan Kim; Shohei Mizuhashi; Munetake Satoh
- Book ID
- 107453373
- Publisher
- Springer US
- Year
- 2005
- Tongue
- English
- Weight
- 249 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0361-5235
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